Laird Tflex HD90000 Thermal Gap Filler Pad Performance Materials

Laird Tflex HD90000 Silicone based Thermal Gap Filler Pad Performance Materials for CPU/GPU (7.5W/mK, 0.198c-in2/W)

Tflex HD90000 combines 7.5 W/mK thermal conductivity with superior pressure versus deflection characteristics. The combination will allow minimal stress on components while also yielding low thermal resistance. As a result, less mechanical and thermal stresses will be experienced within your device.

HD90000 7.5W/MK Silicon Thermal Pad for RTX 3090 3080 GDDR6X RAM

Tflex HD90000 Series Thermal Pad For M2 RTX 3000 3080 3090 Card Video Memory,7.5W/mK,1.0,1.5,2.0,2.5mm Thick,Soft

1 unit = 1 piece (45mm x 45mm)

Features and Benefits

• Low pressure versus deflection
• Excellent surface wetting for low contact resistance
• Minimizes board and component stress
• Low Outgassing
• Low D3-D20 (< 20ppm)
• Large tolerance applications
• Environmentally friendly solution that meets regulatory requirements including RoHS and REACH