Laird Tflex 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of compliancy allows the material to totally blanket the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times. Tflex 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at low pressures. Tflex 300-H is offered with a hard, metallized liner option for easy handling and improved rework. The metallized liner lower coefficient of friction also allows for easy assembly of parts that must slide together, such as a card into a chassis.
Features and Benefits
Typical Properties
Thermal Properties
Good overall experience, just wish the tracking of...
"Good overall experience, just wish the tracking of shipping had more information, i guess it has to do with the chilean shipping company."
good
"good"
AI bot was actually helpful in finding the exact c...
"AI bot was actually helpful in finding the exact cable I needed. I needed a reverse 12vhpwr (psu) to 8 pin PCIe and I was not able to find this cable by searching normally."
My buying experience has been great thus far.
"My buying experience has been great thus far."
Easy
"Easy"
love the customization and appreciate the detail r...
"love the customization and appreciate the detail required for the order. I feel like the cable for my power supply will work properly."
Very good, fast shipment
"Very good, fast shipment"
Seems to be good so far.
"Seems to be good so far."
The only reason I left 2 stars for recommendations...
"The only reason I left 2 stars for recommendations is because Amazon, Newegg, Microcenter, etc are my go to choice. This is the only website that has what I need."
easy
"easy"