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Shin Etsu MicroSi Thermal Interface Material X23 7868 2D 6.2W mK

SKU: CO781
$19.99 $24.99 (You save $5.00)
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Product Description

Shin-Etsu MicroSi Thermal Interface Material X-23-7868-2D (W/mK > 6.2)

X23-7868-2D, is a thermal interface material developed and manufactured by Shin-Etsu Chemical with ease of application in mind. Specifically formulated to include an application chemical to allow ease of screening and other application techniques. With a higher Thermal Conductivity coupled with lower Thermal Resistance exceeds thermal management requirements of high-performance semiconductor devices. Through superior heat dissipation, the X23-7868-2D allows electronic devices to remain cooler and increases their long term reliability.

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MADE IN JAPAN!

  • Excellent thermal resistance (TR) and thermal conductivity (TC)
  • Low viscosity at the time of application, easily applied via dispensing, stencil printing, or screen printing methods
  • Stable homogeneous mixture for consistent thermal performance
  • RoHS and REACH Compliant
  • High volume production product from a proven industry leader Available worldwide through established supply chain networks

General Properties

  • Syringes : 5G
  • Color : Grey 
  • Viscosity (Pa·s) (pre-flash) * : 100
  • Viscosity (Pa·s) (post-flash) * : 680
  • Thermal Resistance ***(mm2-K/W) : 5.0
  • Thermal Conductivity **(W/m °K) (post-flash) : 6.2
  • BLT (µm) (Thin—BLT) (20psi) : 30
Companies like Apple, Google, AMD, Intel, NASA, IBM, HP, Boeing, etc are also buying these Shin-Etsu products from us!

Tags:
  • Shin Etsu X23 7868 2D in Syringe
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