Shin-Etsu MicroSi Thermal Interface Material X-23-7868-2D (W/mK > 6.2)
X23-7868-2D, is a thermal interface material developed and manufactured by Shin-Etsu Chemical with ease of application in mind. Specifically formulated to include an application chemical to allow ease of screening and other application techniques. With a higher Thermal Conductivity coupled with lower Thermal Resistance exceeds thermal management requirements of high-performance semiconductor devices. Through superior heat dissipation, the X23-7868-2D allows electronic devices to remain cooler and increases their long term reliability.
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