This thermal interface compound is developed by Shin Etsu Chemical Co., Ltd. to meet the current and future requirements of high performance microprocessors. It is used to increase surface contact area for heat transfer by minimizing any air bubbles that exists between the top of the processor and the base of the heat sink.
Thermal Paste Comparison - Best Overall Results (Shin Etsu G751)
Source: https://www.amd.com/en/support/kb/faq/cpu-0001
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