Shin Etsu MicroSi Thermal Interface Material X23 8195 4

Shin-Etsu MicroSi Thermal Interface Material X23-8195-4 (3g) 

Shin-Etsu Silicone Thermal Grease: This silicone fluid compound contains thermally-conductive fillers. With a high thermal conductivity value, this product emphasizes high bulk thermal conductivity values and ease of workability. The smaller diameter filler allows the material to achieve thinner bondlines. Ideally suited for CPU's and applications where mating surfaces have minimally uneven surfaces. 

Syringe application: Shin-Etsu MicroSi's syringes are ideal for manual applications assuring that a consistent shot weight is applied to the intended surface. Shin-Etsu MicroSi's SQC processes provide a consistent dispense weight with each syringe. 

MADE IN JAPAN!

Applications

• Developed for Server, data center package
• Lidded and bare die processor

Features & Benefits

• One part solvent free formulation
• Easy application
• Achieves thin Bond Line Thickness (BLT)
• Low thermal resistance

Application Methods

• Screen print
• Stencil print
• Dispense

General Property

• Type of Resin: Silicone
• Type of Main Filler: Aluminum
• Viscosity (Pa-s @25C): 90
• Thermal Conductivity (W/m-K): 4.6
• Minimum BLT (μm): 17
• Thermal Resistance (mm2-K/W) at Minimum BLT: 3.7
• Specific Gravity: 2.5
• Volatile content (%) @150C/24hrs = 0.15