Shin Etsu MicroSi Thermal Interface Material X23 8117 20g

Shin-Etsu’s X-23-8117 (20g) product offering is a thermal interface material developed and manufactured with ease of application in mind. Specifically formulated to include an application chemical optimized for screen printing and other application techniques, X-23-8117 outperforms in high volume manufacturing environments. With high Thermal Conductivity coupled with low Thermal Resistance, this product often exceeds thermal management requirements of high-performance semiconductor devices. Through superior heat dissipation, X-23-8117 allows electronic devices to remain cooler and increases long-term reliability.

MADE IN JAPAN!

• Optimal efficiency and thermal transfer.
• Convenient syringe for easy application.
• High performance thermal grease. Good for general applications. Especially on uneven surface.
• Injector with cap for easy application and storage
• Thermal Conductivity (W/m °K): 6.2
• Thermal Resistance (mm2•K/W):  6.1
• Specific Gravity: 2.8
• Electrically non-conductive
• Viscosity (pre-flash): 80
• Viscosity (post-flash): 700
• Bond Line Thickness (um) @20psi: 26

Source: https://www.amd.com/en/support/kb/faq/cpu-0001