Shin Etsu MicroSi Thermal Interface Material G751 3g

Shin-Etsu MicroSi Thermal Interface Material Thermal Grease G751 (3g) 

Shrinking die and increasing power demands continue to make the thermal solution a critical part of IC package design. Shin-Etsu MicroSi’s G-751 thermal interface material improves performance by enabling packages to run cooler without sacrificing reliability. The ability of G-751 to dissipate heat enables users to reduce the overall cost of their thermal solution. Shin-Etsu MicroSi’s G-751 is designed to meet current and future thermal management requirements, thus providing drop-in solutions for new IC packages, without the expense of qualifications. This highly thermal conductive grease has been successfully used on CPUs, GPUs, PLCs and other temperature sensitive components.

Syringe application: Shin-Etsu MicroSi's syringes are ideal for manual applications assuring that a consistent shot weight is applied to the intended surface. Shin-Etsu MicroSi's SQC processes provide a consistent dispense weight with each syringe. 

MADE IN JAPAN!

Features

• Excellent thermal resistance (TR) and thermal conductivity (TC)
• Low viscosity at the time of application, easily applied via dispensing, stencil printing, or screen printing methods
• Stable homogeneous mixture for consistent thermal performance RoHS and REACH Compliant
• High volume production product from a proven industry leader Available worldwide through established supply chain networks
• Optimal efficiency and thermal transfer.
• Convenient syringe for easy application.
• High performance thermal grease. Good for general applications. Especially on uneven surface.
• Injector with cap for easy application and storage

Material Properties

• Thermal Conductivity: 4.5 (W/m K)
• Specific Gravity: 2.5
• Electrically non-conductive
• Viscosity: (Pa.s @ 25C) 250-400
• Storage Conditions 60F to 85F (15C - 29C)