Honeywell TGP8000PT Thermally Conductive Gap Filling Putty Pads

Honeywell TGP8000PT Thermal Putty Pads are the best-performing gap-filling thermal putty in the world, based on our in-house testing. It works perfectly for VRM in GPUs and laptops. Using TGP8000PT thermal putty along with the legendary Honeywell PTM7950 Phase Change Thermal Pad offers an unmatchable result!

TGP8000PT is designed especially for high-performance chips requiring exceptional thermal performance, durability, and reliability. Nvidia has already been using TGP8000PT for its top-of-the-line flagship AI chips, GPUs and laptops.

Honeywell Thermally Conductive Putty Pads TGP8000PT enables excellent gap-filling capability for applications with large dimensional variances. (8.0 W/m-K, ultra soft pad)

Honeywell Thermally Conductive Putty Pads provide high thermal performance and solid thermal reliability. The material’s putty-like consistency enables excellent gap-filling capability for applications with large dimensional variances. Special surface reinforcement enables easier handling for operators, with no pull-out during high-volume assembly. The product is naturally tacky and requires no additional adhesive to mate to the heat source and heat sink.

Thermal putty pads and thermal gap pads are similar products. For instance, TGP8000 and TGP8000PT both exhibit high thermal conductivity of 8 W/m-K and require at least 10% compression during application. However, the main distinction lies in their material properties. Thermal putty pads are ultra-soft and can be compressed up to 90%. They have minimal tensile strength and elasticity, which means they won’t recover or bounce back. Due to their low stress and high compressibility, thermal putty pads are particularly well-suited for applications with significant dimensional variations, as compared to traditional thermal gap pads

Size & Thickness:

• 80mm x 40mm x 1.0mm
• 80mm x 40mm x 1.5mm
• 80mm x 40mm x 2.0mm

Features & Benefits

• High thermal performance
• Ultra-soft with high compressibility
• High compressibility
• Low thermal impedance
• Excellent gap-filling capability
• Natural tacky to the heatsink and heat source

General Properties

• Color: Grey
• Desc: TGP8000PT-00
• MSDS#: TGP8000PT-00
• Hardness: 5 Shore00, Test Method ASTM D2240
• Specific Gravity: 3.5, Test Method ASTM D792
• Thickness (mm): 0.5-5, Test Method ASTM D374
• Thermal Conductivity: 8.0 W/m-K, Test Method ASTM D5470
• Thermal Impedance: 0.19 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
• Dielectric Constant: 8.5 at 1MHz, Test Method ASTM D150
• Volume Resistivity: 4.0x10¹⁵ ohm-cm, Test Method ASTM D257
• Flammability: V-0, Test Method UL94
• HS Code: 3824.99.99

Reports

• Honeywell Thermal Interface Materials Certificates & Test Reports

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