Shin-Etsu MicroSi Thermal Interface Material X-23-7868-2D (W/mK > 6.2)
X23-7868-2D, is a thermal interface material developed and manufactured by Shin-Etsu Chemical with ease of application in mind. Specifically formulated to include an application chemical to allow ease of screening and other application techniques. With a higher Thermal Conductivity coupled with lower Thermal Resistance exceeds thermal management requirements of high-performance semiconductor devices. Through superior heat dissipation, the X23-7868-2D allows electronic devices to remain cooler and increases their long term reliability.
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MADE IN JAPAN!
- Excellent thermal resistance (TR) and thermal conductivity (TC)
- Low viscosity at the time of application, easily applied via dispensing, stencil printing, or screen printing methods
- Stable homogeneous mixture for consistent thermal performance
- RoHS and REACH Compliant
- High volume production product from a proven industry leader Available worldwide through established supply chain networks
General Properties
- Syringes : 5G
- Color : Grey
- Viscosity (Pa·s) (pre-flash) * : 100
- Viscosity (Pa·s) (post-flash) * : 680
- Thermal Resistance ***(mm2-K/W) : 5.0
- Thermal Conductivity **(W/m °K) (post-flash) : 6.2
- BLT (µm) (Thin—BLT) (20psi) : 30
Companies like Nvidia, Apple, Google, AMD, Intel, Meta, NASA, IBM, HP, Boeing, etc. are buying these
Honeywell and
Shin-Etsu products from us!
![](/product_images/q/660/Shin-Etsu_MicroSi_Thermal_Interface_Material_X-23-7868-2D_%28WmK__6.2%29_%281%29__09043_zoom.png)
![What type of thermal interface material does AMD recommend to be used with an AMD64 processor? What type of thermal interface material does AMD recommend to be used with an AMD64 processor?](/product_images/b/732/What_type_of_thermal_interface_material_does_AMD_recommend_to_be_used_with_an_AMD64_processor__71700_zoom.jpg)
Source: https://www.amd.com/en/support/kb/faq/cpu-0001
Keywords: Shin Etsu X23 7868 2D in Syringe, Thermal Interface Material X23 7868 2D 6.2W mK