Tflex 700 Series Thermal Gap Filler Pad Performance Materials

Tflex 700 is a 5 W/mK soft gap filler thermal interface material with great thermal performance and high compliancy. The soft interface pad conforms to component topography, resulting in little or no stress on the components and mating chassis or parts.

Unique silicone and ceramic filler technology allows a combination of high compliancy and high thermal performance. Tflex 700 is stable from -45ºC thru 200ºC and meets UL 94V0 flame rating. Naturally tacky, it requires no additional adhesive coating which inhibits thermal performance.

STANDARD THICKNESSES Standard thickness 0.020" (0.5mm) through 0.200" (5.0mm) available in 0.010" (0.25mm) increments. MATERIAL NAME AND THICKNESS Tflex - indicates elastomeric gap filler product line. 7XXX - indicates Tflex 700 product line and thickness in mils (0.001-inches). -DC1 - one side tacky; default is both sides tacky. Data for design engineer guidance only. Observed performance varies in application. Engineers are reminded to test the material in application.

Features and Benefits

• Highly compliant
• Low thermal resistance even at low pressure
• Low Dielectric Constant
• Naturally tacky for adhesion during assembly and transport

Typical Properties

• Color: Dark Grey
• Density (g/cc): 1.70
• Operating Temperature Max (Celsius): 200
• Operating Temperature Min (Celsius): -40
• Outgassing CVCM (%): 0.130
• Outgassing TML (%): 0.830
• Shelf Life: 2 years from Date of Shipment

Thermal Properties

• Thermal Conductivity (W/mK): 5.00
• Thermal Resistance @10 psi Max (C-in2/W): 1.717
• Thermal Resistance @10 psi Min (C-in2/W): 0.330
• Thermal Resistance @30 psi Max (C-in2/W): 1.197
• Thermal Resistance @30 psi Min (C-in2/W): 0.231
• Thermal Resistance @50 psi Max (C-in2/W): 0.725
• Thermal Resistance @50 psi Min (C-in2/W): 0.193