Performance Materials Tputty 607 Thermal Interface Putty 10g

Performance Materials Tputty 607 Thermal Interface Putty (10g) - One Part Liquid Dispensable Gap Filler

Tputty 607 is a high thermally conductive single part dispensable material designed with automation and vertical stability in mind. It has leveraged its knowledge of thermally conductive fillers and resin systems to develop a single part dispensable that demonstrates reliability in a variety of application orientations. Tputty 607 is ideal for applications that can benefit from automation; and allows minimization of SKUs in applications with gap variability. In addition to providing application flexibility and variable gap adaptation, Tputty 607 will exert minimal stress on your component while maintaining interface contact to maximize thermal transfer. Combined with the global technical support and global footprint, deploying Tputty 607 is easier than ever.

Features and Benefits

• Demonstrated thermal cycling stability
• Low outgassing per ASTM E595
• Complete Dispensing Solution Options Available

Capabilities

• Automated Packaging
• Automated Pad Placement
• Custom Automation
• Custom Product Development
• Modeling
• Prototyping
• Service
• Testing

Documents

• Datasheet

Technical Specification

• Color: Blue
• Density (g/cc): 3.50
• Minimum Bondline Thickness (microns): 150
• Minimum Bondline Thickness (mm): 0.15
• Operating Temperature Max (Celsius): 200
• Operating Temperature Min (Celsius): -40
• Outgassing CVCM (%): 0.010
• Outgassing TML (%): 0.204
• Shelf Life: 6 months
• Thermal Conductivity (W/mK): 6.40
• Dielectric Constant: 15.00
• Volume Resistivity: 1.00 x10^13 Ohm-cm
• ROHS Compliant: Yes
• UL Flammability Rating: V-0

TPUTTY-607