Shin-Etsu MicroSi Thermal Interface Material X-23-7921-5 W/m.K > 6.0 (5g) Full Kit Box Set
Shin-Etsu Silicone Thermal Grease: This silicone fluid compound contains thermally-conductive fillers. With a high thermal conductivity value, this product emphasizes high bulk thermal conductivity values and ease of workability. The smaller diameter filler allows the material to achieve thinner bondlines. Ideally suited for CPU's and applications where mating surfaces have minimally uneven surfaces.
Syringe application: Shin-Etsu MicroSi's syringes are ideal for manual applications assuring that a consistent shot weight is applied to the intended surface. Shin-Etsu MicroSi's SQC processes provide a consistent dispense weight with each syringe.
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By Hariz on 2020-06-04 | Verified Purchase ✓
"So far so good. Need to check the item first b4 any other review"
By Justin on 2020-06-04 | Verified Purchase ✓
"The shopping experience was quick and easy. I really like the extra shipping options too."
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"Thanks for the great service. I had a nice chat with a tech over the net and she gave me great advice."
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"Quick, no hassle."
By Belal on 2020-06-01 | Verified Purchase ✓
"it was good , customer service was very helpful , can't wait for my product to arrive"
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