Honeywell TGP3500PT Thermally Conductive Gap Filling Putty Pads

Honeywell Thermally Conductive Putty Pads TGP3500PT series enables excellent gap-filling capability for applications with large dimensional variances. (3.5 W/m·K, ultra soft pad)

Honeywell Thermally Conductive Putty Pads provide high thermal performance and solid thermal reliability. The material’s putty-like consistency enables excellent gap-filling capability for applications with large dimensional variances. Special surface reinforcement enables easier handling for operators, with no pull-out during high-volume assembly. The product is naturally tacky and requires no additional adhesive to mate to the heat source and heat sink.

Typical Applications

• EV battery & charging station
• Automotive electronics
• Power devices & modules
• Telecommunications & network servers

Features

• High thermal performance
• Ultra-soft
• High compressibility
• Excellent gap-filling capability
• Naturally tacky

Size & Thickness:

• 80mm x 40mm x 1.75mm

Features & Benefits

• High thermal performance
• Ultra-soft with high compressibility
• High compressibility
• Low thermal impedance
• Excellent gap-filling capability
• Natural tacky to the heatsink and heat source

General Properties

• Color: Green
• Hardness: 5 Shore00, Test Method ASTM D2240
• Specific Gravity: 3.2, Test Method ASTM D792
• Thickness (mm): 1.75mm, Test Method ASTM D374
• Thermal Conductivity: 3.5 W/m-K, Test Method ASTM D5470
• Thermal Impedance: 0.45 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
• Dielectric Constant: 6.4 at 1MHz, Test Method ASTM D150
• Volume Resistivity: 4.0x10 ohm-cm, Test Method ASTM D257
• Flammability: V-0, Test Method UL94

Reports

• Honeywell Thermal Interface Materials Certificates & Test Reports

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