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This thermal interface compound is developed by Shin Etsu Chemical Co., Ltd. to meet the current and future requirements of high performance microprocessors. It is used to increase surface contact area for heat transfer by minimizing any air bubbles that exists between the top of the processor and the base of the heat sink.
By Chris on 2020-02-20 | Verified Purchase ✓
"Friendly, fast sending, good quality = happy customer"
By Charlie on 2020-02-20 | Verified Purchase ✓
"Simple to navigate and I can find the components I need for my PC that I can trust to sell me."
By Gary on 2020-02-19 | Verified Purchase ✓
"Everythings great so far. I know more after I receive my order."
By Anonymous Customer on 2020-02-19 | Verified Purchase ✓
"the reason I only put 3 and 4 stars is because I'm waiting for my order to be complete"
By Tai on 2020-02-19 | Verified Purchase ✓
"Referred by my Computer parts supplier SCORPTEC"
By Kim on 2020-02-18 | Verified Purchase ✓
"It was an easy page to navigate. good pictures."
By Daryl on 2020-02-18 | Verified Purchase ✓
"Great range of unobtanium."
By Steven on 2020-02-18 | Verified Purchase ✓
"The item I needed was easy to find and easy to order."
By Dana on 2020-02-16 | Verified Purchase ✓
"I was looking for 90 angle cables and you had them. Thank you."
By Elston on 2020-02-14 | Verified Purchase ✓
"Quick, easy with very little messing about. Nice one ModDiy"
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