Honeywell HT10000 Thermal Conductive Gap Filler

Honeywell HT10000 one-part Gap Filler provides an effective thermal properties and high conformability with its high compressibility. It is formulated to deliver high dispense rates for improved productivity, long term reliability performance and easy reworkable. It is designed to minimize thermal resistance at interfaces, maintain excellent performance through reliability testing.

Honeywell HT10000 Thermal Paste delivers superior heat transfer, helping your devices operate cooler and more efficiently. Engineered for effortless application, it fills microscopic surface gaps to optimize thermal conductivity and reduce the risk of overheating. Perfect for CPUs, GPUs, and other high‑performance electronics, HT10000 enhances hardware longevity while maximizing system performance. Trust Honeywell HT10000 for dependable, long‑lasting protection against heat buildup.

Honeywell HT10000 is a silicone‑based, pre‑cured thermal gap filler with 10.0 W/m·K thermal conductivity and 0.16 °C·in²/W thermal impedance 0.16 °C·in²/W thermal impedance (1 mm @ 10 psi). It is designed for high‑performance electronics cooling, with excellent gap‑filling, low oil bleeding, and easy reworkability. 

Features & Benefits

• High thermal performance
• Low contact resistance
• Easily dispensable and reworkable
• Excellent gap-filling capability
• Naturally tacky
• Low oil bleeding

Typical Applications

• Consumer electronics
• Telecommunications equipment
• Automotive electronics
• Power supplies & semiconductors
• Memory & power modules
• Power electronics

General Properties

• Syringes: 5G
• Feature: Silicone-based (Pre-cured)
• Color: Dark grey 
• Visual Thermal Conductivity (W/m·K): 10.0 (ASTM D5470)
• Thermal Impedance (°C.In2/W): 0.16 (ASTM D5470)
• Dispense Rate (g/min): 15 (90psi, 30cc EFD syringe)
• Density(g/cm3): 3.22 (ASTM D792)
• Volatile Content (TML%): <0.4 (HON Internal)
• HS Code: 3824.99.99

Reports

• HT10000 Datasheets & Reports

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