Tflex 300 Series Thermal Gap Filler Pad Performance Materials

Tflex 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of compliancy allows the material to totally blanket the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times. Tflex 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at low pressures. Tflex 300-H is offered with a hard, metallized liner option for easy handling and improved rework. The metallized liner lower coefficient of friction also allows for easy assembly of parts that must slide together, such as a card into a chassis.

Features and Benefits

• Extreme compliancy allows material to “totally blanket” component(s)
• Low compression set enables the pad to be reused many times

Typical Properties

• Color: Light Green
• Density (g/cc): 1.80
• Operating Temperature Max (Celsius): 160
• Operating Temperature Min (Celsius): -40
• Outgassing CVCM (%): 0.100
• Outgassing TML (%): 0.560
• Shelf Life: 2 years from Date of Shipment

Thermal Properties

• Thermal Conductivity (W/mK): 1.20
• Thermal Resistance @10 psi Max (C-in2/W): 4.256
• Thermal Resistance @10 psi Min (C-in2/W): 1.135
• Thermal Resistance @30 psi Max (C-in2/W): 2.981
• Thermal Resistance @30 psi Min (C-in2/W): 0.905
• Thermal Resistance @50 psi Max (C-in2/W): 1.775
• Thermal Resistance @50 psi Min (C-in2/W): 0.740