TGP8000 High Thermal Performance Thermal Gap Filler Pads

THERMAL GAP FILLER PADS TGP8000

Honeywell Thermal Gap Filler Pads (TGPs) provide high thermal performance with ease of use for many applications. Ultra-high compressibility enables low stress and excellent conformity to mating surfaces. Honeywell TGP models are naturally tacky, and require no additional adhesive which could inhibit thermal performance. TGP models have been designed to minimize thermal resistance at interfaces, and maintain effective performance through reliability testing. TGP models are silicone based, therefore they offer a certain anti-shock effect, with electrical isolation and non-flammability.

Exhibits low oil bleeding and outgassing along with low hardness. Naturally tacky, and requires no additional adhesive which could inhibit thermal performance. (Grey color, 0.2 Thermal Impedance, 8.0 Thermal Conductivity, Hardness 30 on Shore 00)

Honeywell Thermal Interface Materials Certificates & Test Reports

Size & Thickness:

• 100mm x 50mm x 1.0mm
• 100mm x 50mm x 1.5mm
• 100mm x 50mm x 2.0mm

Features & Benefits

• High thermal performance
• Ultra-high compressibility for low stress applications
• Excellent surface wetting for low contact resistance
• High reliability
• Electrically insulating

General Properties

• Color: Grey
• Thickness: 30 Shore00, Test Method ASTM D2240
• Shelf Life: 12 months
• Specific Gravity: 3.4, Test Method ASTM D792
  
• Thermal Conductivity: 8.0 W/m-K, Test Method ASTM D5470
  
• Thermal Impedance: 0.20 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
  
• Dielectric Constant: 8.3 at 1MHz, Test Method ASTM D150
  
• Volume Resistivity: 6.47x1015 ohm-cm, Test Method ASTM D257
  
• Flammability: V-0, Test Method UL94