Thermal Interface Material X23 7762 4W mK 3g

Shin-Etsu Silicone Thermal Grease: This silicone fluid compound contains thermally-conductive fillers. With a high thermal conductivity value, this product emphasizes high bulk thermal conductivity values and ease of workability. The smaller diameter filler allows the material to achieve thinner bondlines. Ideally suited for CPU's and applications where mating surfaces have minimally uneven surfaces. 

Syringe application: Shin-Etsu MicroSi's syringes are ideal for manual applications assuring that a consistent shot weight is applied to the intended surface. Shin-Etsu MicroSi's SQC processes provide a consistent dispense weight with each syringe. 

MADE IN JAPAN!

• Optimal efficiency and thermal transfer.
• Convenient syringe for easy application.
• High performance thermal grease. Good for general applications. Especially on uneven surface.
• Injector with cap for easy application and storage
• Thermal Conductivity: 4.0 (W/m K)
• Specific Gravity: 2.6
• Electrically non-conductive
• Viscosity: (Pa.s @ 25C) 250
• Storage Conditions 60F to 85F (15C - 29C)

AMD offical recommended thermal paste materials: