Thermal Interface Material X23 7868 2D 6.2W mK

Name: Thermal Interface Material X23 7868 2D 6.2W mK
Brand: Shin-Etsu MicroSi
SKU: X23-7868-2D
Price: 19.99 USD
Availability: InStock
Rating: 4.7 (25392 reviews)

SKU: X23-7868-2D | Brand / Compatible with: Shin-Etsu MicroSi

Shin Etsu MicroSi Thermal Interface Material X23 7868 2D 6.2W mK

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Product Description

Shin-Etsu MicroSi Thermal Interface Material X-23-7868-2D (W/mK > 6.2)

X23-7868-2D, is a thermal interface material developed and manufactured by Shin-Etsu Chemical with ease of application in mind. Specifically formulated to include an application chemical to allow ease of screening and other application techniques. With a higher Thermal Conductivity coupled with lower Thermal Resistance exceeds thermal management requirements of high-performance semiconductor devices. Through superior heat dissipation, the X23-7868-2D allows electronic devices to remain cooler and increases their long term reliability.

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MADE IN JAPAN!

Excellent thermal resistance (TR) and thermal conductivity (TC)
Low viscosity at the time of application, easily applied via dispensing, stencil printing, or screen printing methods
Stable homogeneous mixture for consistent thermal performance
RoHS and REACH Compliant
High volume production product from a proven industry leader Available worldwide through established supply chain networks

General Properties

Syringes : 5G
Color : Grey
Viscosity (Pa·s) (pre-flash) * : 100
Viscosity (Pa·s) (post-flash) * : 680
Thermal Resistance ***(mm2-K/W) : 5.0
Thermal Conductivity **(W/m °K) (post-flash) : 6.2
BLT (µm) (Thin—BLT) (20psi) : 30

Companies like Nvidia, Apple, Google, AMD, Intel, NASA, IBM, HP, Boeing, etc are also buying these Shin-Etsu products from us!

What type of thermal interface material does AMD recommend to be used with an AMD64 processor?

Source: https://www.amd.com/en/support/kb/faq/cpu-0001

Keywords: Shin Etsu X23 7868 2D in Syringe, Thermal Interface Material X23 7868 2D 6.2W mK

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2022-12-05

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