Laird TPCM 780SP High Performance CPU Interface Material (W/mK > 5.5)

Tpcm™ 780SP is a high performance, inherently tacky, easy to rework phase change thermal interface material. Developed specifically to meet the high thermal conductivity and low thermal resistance requirements of today’s demanding processors. This silicone-free material is so soft that it begins to flow as the temperature is elevated by just a small amount. Also, since no tabs are required, Tpcm™ 780SP eliminates the need for expensive converting.

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• Minimizes contact thermal resistance by filling the microscopic irregularities of the components it contacts. Begins to soften and flow at approximately 45ºC
• Designed to minimize migration (pump out) at CPU operating temperatures using a unique material formulation that softens, but does not fully change phase
• Silicone-free for applications that are silicone sensitive
• Outstanding thermal performance helps to ensure CPU/application reliability
• No mess due to thixotropic characteristics which prevent flow outside of interface • Very soft at room temperature, therefore less stress on board during assembly

General Properties

• Syringes : 5G
• Color : Grey
• Viscosity (Pa·s) : 90 - 140
• Thermal Resistance ***(cm2-K/W) : 0.025
• Thermal Conductivity **(W/m °K) (post-flash) : 5.5

• laird tpcm780sp
• TPCM 780SP