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Dow Corning TC 5688 Thermally Conductive Compound 3g 8.0w mK

SKU: TC-5688
$19.99
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Product Description

Dow Corning®TC-5688 Thermally Conductive Compound was developed exclusively for Intel microprocessors in collaboration with the Intel Mobile Platforms Group. TC-5688 was developed and optimized for multi-chip packages and employs a proprietary formula of advanced silicone polymers that interacts with thermally conductive filler particles to form a matrix that is highly resistant to pump-out and other common failure mechanisms. The result is a thermal compound that delivers extreme performance and exceptional reliability for the thermal interface needs.

TC-5688

  • Low thermal resistance for superior heat transfer, 0.061cm²C/W @40 PSI
  • Thin bond line for hi-efficiency conductivity
  • Enhance cooling performance
  • Non pressure dependent
  • Multi-language instructions included
  • RoHS compliant
  • AMD recommended

Specifications:

  • Colour: Grey
  • Thermal conductivity: 8.0W/mK
  • Operating temperature: -50°C ~ 400°C
  • Volume: >3g
  • Product code: TC 5688
Companies like Apple, Google, AMD, Intel, NASA, IBM, HP, Boeing, etc are also buying these Dow Corning products from us!

Tags:
  • Dow Corning TC 5688 in Syringe
  • tc5688
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Product Reviews

  1. good

    By Prince T on 26 Oct 2020 | Verified Purchase ✓

    "good"


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    By David C N on 26 Oct 2020 | Verified Purchase ✓

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    By Anonymous Customer on 25 Oct 2020 | Verified Purchase ✓

    "shipping is expensive"


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    By David on 25 Oct 2020 | Verified Purchase ✓

    "10/10 will shop here again!"


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    "Very easy to order from. Very nice website too."


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    By Agamemnon K on 24 Oct 2020 | Verified Purchase ✓

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  10. Thanks

    By Anonymous Customer on 23 Oct 2020 | Verified Purchase ✓

    "Thanks"


  1. Excellent store :)

    By Geir M on 2019-04-24 | Verified Purchase ✓

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