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Dow Corning TC 5688 Thermally Conductive Compound 3g 8.0w mK

SKU: TC-5688
$19.99
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Product Description

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Dow Corning®TC-5688 Thermally Conductive Compound was developed exclusively for Intel microprocessors in collaboration with the Intel Mobile Platforms Group. TC-5688 was developed and optimized for multi-chip packages and employs a proprietary formula of advanced silicone polymers that interacts with thermally conductive filler particles to form a matrix that is highly resistant to pump-out and other common failure mechanisms. The result is a thermal compound that delivers extreme performance and exceptional reliability for the thermal interface needs.

TC-5688

  • Low thermal resistance for superior heat transfer, 0.061cm²C/W @40 PSI
  • Thin bond line for hi-efficiency conductivity
  • Enhance cooling performance
  • Non pressure dependent
  • Multi-language instructions included
  • RoHS compliant
  • AMD recommended

Specifications:

  • Colour: Grey
  • Thermal conductivity: 8.0W/mK
  • Operating temperature: -50°C ~ 400°C
  • Volume: >3g
  • Product code: TC 5688
Companies like Apple, Google, AMD, Intel, NASA, IBM, HP, Boeing, etc are also buying these Dow Corning products from us!

Tags:
  • Dow Corning TC 5688 in Syringe
  • tc5688
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