Dow Corning®TC-5688 Thermally Conductive Compound was developed exclusively for Intel microprocessors in collaboration with the Intel Mobile Platforms Group. TC-5688 was developed and optimized for multi-chip packages and employs a proprietary formula of advanced silicone polymers that interacts with thermally conductive filler particles to form a matrix that is highly resistant to pump-out and other common failure mechanisms. The result is a thermal compound that delivers extreme performance and exceptional reliability for the thermal interface needs.
By Anonymous Customer on 29 Nov 2023 | Verified Purchase ✓
"Super fast shipment! Will Order again :)"
By Frederick S on 28 Nov 2023 | Verified Purchase ✓
"Easy to search in naturalish language. Well done."
By Alexis on 28 Nov 2023 | Verified Purchase ✓
"Webie from customer support gave me a free shipping code since 1 item i had cost 10$ and the item was 10$ which made no sense, because i reached out and the customer support helped i will buy more from the company, i just hope more people know so i can recommend this site"
By Frederick A on 27 Nov 2023 | Verified Purchase ✓
"Very nice cables and very quick delivery considering other side of the world"
By Gary on 26 Nov 2023 | Verified Purchase ✓
"Quick and easy"
By Dónal L on 25 Nov 2023 | Verified Purchase ✓
"Easy to negotiate your system and the wide range of products"
By PAT D on 23 Nov 2023 | Verified Purchase ✓
"NOT SURE IF PAYMENT WENT THROUGH (PAYPAL O.K.'D IT BUT CARD ISSUER DIDN'T - PLEASE ADVISE. All was o.k.'d (card restriction problem, not any problem with moddiy.) thanks."
By Tim M on 22 Nov 2023 | Verified Purchase ✓
"Great simple website"
By Simon D on 18 Nov 2023 | Verified Purchase ✓
"Chat was helpful. Cables not available elsewhere."
By Francisco L on 17 Nov 2023 | Verified Purchase ✓
By Geir M on 2019-04-24 | Verified Purchase ✓
"Excellent store :)"