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This thermal interface compound is developed by Shin Etsu Chemical Co., Ltd. to meet the current and future requirements of high performance microprocessors. It is used to increase surface contact area for heat transfer by minimizing any air bubbles that exists between the top of the processor and the base of the heat sink.
Posted by duffman327 on 2nd Mar 2012
Quick Postage is Sweet
Posted by importsaresick on 23rd Dec 2011
Great item cheers :)
Posted by efectoarray on 9th Dec 2011
fast and reliable, very good quality, all good.
Posted by lilmrjacob on 17th Oct 2011
great sellers quick postage the best communication ever will do busines again!!
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